We have a New entry in the X58 sweepstakes:

EVGA gives a sneak preview of its X58 motherboard

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The T1 Trust, PRR T1 Class 4-4-4-4 #5550, 1 of America's First HST's

Register Hardware has posted a review of the Asus P6T Deluxe, you can view it here:
Register Hardware Reviews the Asus P6T

This is a stupid group of questions, but nonetheless, I'm curious, what is the deal with the 1.65V limit, does this apply to a specific mobo? RAM? Who will it affect?

Luke.

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- Luke.

It means officially if I where to boost the ram over 1.65V it will fry the CPU but un-officially I could exceed the 1.65V for the memory and over clock it by increasing the memory Volts over 1.65V and not fry the CPU. Because the CUP has the memory controller on this chip no Front Side Bus. I think from what I have been reading. Intel also will come out with a socket LGA1066. I think it applies to certain motherboard and not to others I think this ASUS is one of the motherboards that it does applies to. I am going to wait and see which one is best and which socket.

Can any of them also be not very ugly? About the only ones looking a bit 'cool' are the Asus and the MSI. Not that I would ever touch an MSI board again after I've had 3 of them blow themselves up within 6 months of using them, but OK.

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I second that about MSI motherboards.

Here's something on the i7 front:

Core i7 with lower TDP to launch next year

Fudzilla and a grain of salt over the shoulder(Left or Right) wrote:

Intel is working on a version of the Core i7 processors which will have a lower TDP than the current 130W model

Asus P6T Deluxe gets tested

And according to Register Hardware » Reviews » Bits 'n' Chips: Triple-channel is not so hot

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The T1 Trust, PRR T1 Class 4-4-4-4 #5550, 1 of America's First HST's

Ok here's some more on Foxconns Bloodrage motherboard in It's final design configuration over at the vr-zone:


http://www.vr-zone.com/articles/foxconn-quantum-force-blood-rage-final-look/6150.html

Notice something?

One can use 775 bolt through heatsinks provided they can reach through the motherboard, 775 Pushpin heatsinks can't be used without a bolt thru kit.

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The T1 Trust, PRR T1 Class 4-4-4-4 #5550, 1 of America's First HST's

Patriot has announced Tri Channel Kits according to Hexus.

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The T1 Trust, PRR T1 Class 4-4-4-4 #5550, 1 of America's First HST's

Tech Powerup has word that Noctua is offering Free upgrade kits to enable LGA1366 compatibility with their heatsinks.


http://www.techpowerup.com/74660/Noctua_to_Offer_Free_LGA-1366_Compatibility_Upgrades.html

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The T1 Trust, PRR T1 Class 4-4-4-4 #5550, 1 of America's First HST's

Although it has nothing to do with Nehalem, and all it is is just a piece of info' fromm Wikipedia, quoting Intel...

"If the transition to 22 nm is difficult, then Sandy Bridge may go over three generations (Sandy Bridge, Ivy Bridge, and another Bridge) as opposed to two with Nehalem and Core 2"

So "Haswell" may be delayed a few years...

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- Luke.

Repost:
JokerCPoC wrote:

PaulDHarris wrote:

Concerning the LGA1066 socket here is the latest from MaximunPC magazine latest print edition DEC 08 article "Technology Watch List" pp32-34 by the staff at MaximumPC.

MaximumPC wrote:

NEW SOCKET ON THE BLOCK
So all this CPU goodness and performance will drop right into that $450 LGA775 board you just bought, right? Of course not. Ung's Law dictates that the minute you buy expensive hardware, something better will arrive that makes what you just bought obsolete.
Intel isn't doing this just to piss people off (although a history of such behavior has had that result). Since Core i7 moves the memory controller directly into the CPU, Intel added a load of pins that go directly to the memory modules. The new standard bearer for performance boxes is the LGA1366 socket. It looks functionally similar to the LGA775, with the obvious addition of more pins. More pins also means a bigger socket, which means your fancy heatsink is also likely headed to the recycle bin. LGA1366 boards space the heatsink mounts just a tad bit wider, just enough to make your current heatsink incompatible. There's a chance that some third-party heatsink makers will offer updated mounts to make your current heatsink work, but that's not known yet.
What will be interesting to heatsink aficionados is Intel's encouragement that vendors rate the heat-sinks using a unified thermal rating that will be tied to the Turbo mode settings. For more information, see the Turbo mode sidebar below.
THE SECOND COMING
Intel is adopting more than just AMD's integrated memory controller with its new Core i7 chips; it's also adopting AMD's abandoned Socket 940/754 two-socket philosophy. For the high end, the LGA1366 socket will offer tri-channel RAM and a high-performance OPI interface. For mainstream users, Intel will offer a dual-channel DDR3 design built around a new LGA1066 socket late next year. LGA1160 isn't just about shedding one channel of DDR3 though; LGA1066-based CPUs will also bring direct-attach PCI Express to the table.
Instead of PCI Express running through the chipset, as it does with existing Core 2 and the new performance Core i7, PCI-E will reside on the die of LGA1066 CPUs. With the PCI-E in the CPU itself, Intel will reuse its fairly slow DMI interface to connect the CPU to a single-chip south bridge. The two chips Intel will introduce are the quad-core Lynnfield and the dual-core Havendale. Havendale CPUs will actually feature a newly designed graphics core inside the heat spreader that will talk to the CPU core via a high-speed QPI interface. Both chips will feature Hyper-Threading on all cores.
Many AMD users got a royal screwing when the company abandoned both Socket 940 and Socket 754 for a unified Socket 939; could Intel do something similar? We asked Intel point blank whether LGA1366 would eventually be abandoned for LGA1160; the company told us it fully intends to support both platforms.

So I haven't decided which Intel to choose from yet so I am waiting to see and will upgrade my current Q6600 chip with a new board.
Also I believe I have read that the i7 will run at 130 watts that's a lot of heat.

I believe that's LGA1160 and not LGA1066, In any case 1160 is so far being aimed squarely at the OEM sector from what I've read so far(Dell, HP, etc), I've not even heard a peep as to what motherboard makers are going to do there, Not one thing.
P55 Ibex Peak Chipset(Google Search)
I looked for an LGA1066 chipset and I could not find anything of course, Time will tell If It really will ever exist or not. :D

Details on Intel's P55 Express Chipset Surface
The Ibex peak will come in Q3 2009 as originally planned

Edit: Any cpu made for X58 will not be compatible with P55 and vice versa too as there is a difference in the arrangement and the sheer number of pins the cpus sit on.

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The T1 Trust, PRR T1 Class 4-4-4-4 #5550, 1 of America's First HST's

The MaximumPC article mentions both LGA1066 and LGA1160 and LGA1366? So I am confused?

Repost:
JokerCPoC wrote:

PaulDHarris wrote:

Concerning the LGA1066 socket here is the latest from MaximunPC magazine latest print edition DEC 08 article "Technology Watch List" pp32-34 by the staff at MaximumPC.

MaximumPC wrote:

NEW SOCKET ON THE BLOCK
So all this CPU goodness and performance will drop right into that $450 LGA775 board you just bought, right? Of course not. Ung's Law dictates that the minute you buy expensive hardware, something better will arrive that makes what you just bought obsolete.
Intel isn't doing this just to piss people off (although a history of such behavior has had that result). Since Core i7 moves the memory controller directly into the CPU, Intel added a load of pins that go directly to the memory modules. The new standard bearer for performance boxes is the LGA1366 socket. It looks functionally similar to the LGA775, with the obvious addition of more pins. More pins also means a bigger socket, which means your fancy heatsink is also likely headed to the recycle bin. LGA1366 boards space the heatsink mounts just a tad bit wider, just enough to make your current heatsink incompatible. There's a chance that some third-party heatsink makers will offer updated mounts to make your current heatsink work, but that's not known yet.
What will be interesting to heatsink aficionados is Intel's encouragement that vendors rate the heat-sinks using a unified thermal rating that will be tied to the Turbo mode settings. For more information, see the Turbo mode sidebar below.
THE SECOND COMING
Intel is adopting more than just AMD's integrated memory controller with its new Core i7 chips; it's also adopting AMD's abandoned Socket 940/754 two-socket philosophy. For the high end, the LGA1366 socket will offer tri-channel RAM and a high-performance OPI interface. For mainstream users, Intel will offer a dual-channel DDR3 design built around a new LGA1066 socket late next year. LGA1160 isn't just about shedding one channel of DDR3 though; LGA1066-based CPUs will also bring direct-attach PCI Express to the table.
Instead of PCI Express running through the chipset, as it does with existing Core 2 and the new performance Core i7, PCI-E will reside on the die of LGA1066 CPUs. With the PCI-E in the CPU itself, Intel will reuse its fairly slow DMI interface to connect the CPU to a single-chip south bridge. The two chips Intel will introduce are the quad-core Lynnfield and the dual-core Havendale. Havendale CPUs will actually feature a newly designed graphics core inside the heat spreader that will talk to the CPU core via a high-speed QPI interface. Both chips will feature Hyper-Threading on all cores.
Many AMD users got a royal screwing when the company abandoned both Socket 940 and Socket 754 for a unified Socket 939; could Intel do something similar? We asked Intel point blank whether LGA1366 would eventually be abandoned for LGA1160; the company told us it fully intends to support both platforms.

So I haven't decided which Intel to choose from yet so I am waiting to see and will upgrade my current Q6600 chip with a new board.
Also I believe I have read that the i7 will run at 130 watts that's a lot of heat.

I believe that's LGA1160 and not LGA1066, In any case 1160 is so far being aimed squarely at the OEM sector from what I've read so far(Dell, HP, etc), I've not even heard a peep as to what motherboard makers are going to do there, Not one thing.
P55 Ibex Peak Chipset(Google Search)
I looked for an LGA1066 chipset and I could not find anything of course, Time will tell If It really will ever exist or not. :D

Details on Intel's P55 Express Chipset Surface
The Ibex peak will come in Q3 2009 as originally planned

Edit: Any cpu made for X58 will not be compatible with P55 and vice versa too as there is a difference in the arrangement and the sheer number of pins the cpus sit on.

The MaximumPC article mentions both LGA1066 and LGA1160 and LGA1366? So I am confused?

Repost:
JokerCPoC wrote:

PaulDHarris wrote:

Concerning the LGA1066 socket here is the latest from MaximunPC magazine latest print edition DEC 08 article "Technology Watch List" pp32-34 by the staff at MaximumPC.

MaximumPC wrote:

NEW SOCKET ON THE BLOCK
So all this CPU goodness and performance will drop right into that $450 LGA775 board you just bought, right? Of course not. Ung's Law dictates that the minute you buy expensive hardware, something better will arrive that makes what you just bought obsolete.
Intel isn't doing this just to piss people off (although a history of such behavior has had that result). Since Core i7 moves the memory controller directly into the CPU, Intel added a load of pins that go directly to the memory modules. The new standard bearer for performance boxes is the LGA1366 socket. It looks functionally similar to the LGA775, with the obvious addition of more pins. More pins also means a bigger socket, which means your fancy heatsink is also likely headed to the recycle bin. LGA1366 boards space the heatsink mounts just a tad bit wider, just enough to make your current heatsink incompatible. There's a chance that some third-party heatsink makers will offer updated mounts to make your current heatsink work, but that's not known yet.
What will be interesting to heatsink aficionados is Intel's encouragement that vendors rate the heat-sinks using a unified thermal rating that will be tied to the Turbo mode settings. For more information, see the Turbo mode sidebar below.
THE SECOND COMING
Intel is adopting more than just AMD's integrated memory controller with its new Core i7 chips; it's also adopting AMD's abandoned Socket 940/754 two-socket philosophy. For the high end, the LGA1366 socket will offer tri-channel RAM and a high-performance OPI interface. For mainstream users, Intel will offer a dual-channel DDR3 design built around a new LGA1066 socket late next year. LGA1160 isn't just about shedding one channel of DDR3 though; LGA1066-based CPUs will also bring direct-attach PCI Express to the table.
Instead of PCI Express running through the chipset, as it does with existing Core 2 and the new performance Core i7, PCI-E will reside on the die of LGA1066 CPUs. With the PCI-E in the CPU itself, Intel will reuse its fairly slow DMI interface to connect the CPU to a single-chip south bridge. The two chips Intel will introduce are the quad-core Lynnfield and the dual-core Havendale. Havendale CPUs will actually feature a newly designed graphics core inside the heat spreader that will talk to the CPU core via a high-speed QPI interface. Both chips will feature Hyper-Threading on all cores.
Many AMD users got a royal screwing when the company abandoned both Socket 940 and Socket 754 for a unified Socket 939; could Intel do something similar? We asked Intel point blank whether LGA1366 would eventually be abandoned for LGA1160; the company told us it fully intends to support both platforms.

So I haven't decided which Intel to choose from yet so I am waiting to see and will upgrade my current Q6600 chip with a new board.
Also I believe I have read that the i7 will run at 130 watts that's a lot of heat.

I believe that's LGA1160 and not LGA1066, In any case 1160 is so far being aimed squarely at the OEM sector from what I've read so far(Dell, HP, etc), I've not even heard a peep as to what motherboard makers are going to do there, Not one thing.
P55 Ibex Peak Chipset(Google Search)
I looked for an LGA1066 chipset and I could not find anything of course, Time will tell If It really will ever exist or not. :D

Details on Intel's P55 Express Chipset Surface
The Ibex peak will come in Q3 2009 as originally planned

Edit: Any cpu made for X58 will not be compatible with P55 and vice versa too as there is a difference in the arrangement and the sheer number of pins the cpus sit on.

I don't even know where the Maximum PC article You mentioned in the other thread is located at, So far from what I've read elsewhere nobody that I can find makes any mention of a socket LGA1066 and so It may not exist, Of course LGA1160(P55) and LGA1366(X58) do exist.

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The T1 Trust, PRR T1 Class 4-4-4-4 #5550, 1 of America's First HST's

It's in the print editon MaximumPC DEC 08 article "Technology Watch List" pp32-34
It' not on the internet and it mentions LGA1066 and LGA1366 the LGA1160 was a scan error to text. I rechecked the story and it mentions LGA1366 and LGA1066.

It's in the print edition MaximumPC DEC 08 article "Technology Watch List" pp32-34
It' not on the internet and it mentions LGA1066 and LGA1366 the LGA1160 was a scan error to text. I rechecked the story and it mentions LGA1366 and LGA1066.

Well that explains that, Now LGA1066(Obsolete term now) is called LGA1160(the number of pins in the socket) as 1066 or 1060 is confusing and not accurate now. So LGA1160 is the proper term for the Lynnfield cpu and chipset(P55) which isn't physically compatible with LGA1366(X58) at all.

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The T1 Trust, PRR T1 Class 4-4-4-4 #5550, 1 of America's First HST's

Thanks for clearing that up Joker!

Bit-Tech has posted pics of Gigabytes final X58 motherboard designs(both of them):

http://www.bit-tech.net/news/2008/10/27/gigabyte-shows-bit-tech-its-final-x58s/1

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The T1 Trust, PRR T1 Class 4-4-4-4 #5550, 1 of America's First HST's

Hi Joker check this out at MaximumPC on line article "Exclusive: We Build the First Nehalem System. Don't Tell Intel!" by staff writer Posted 08/06/08 at 11:07:36 AM | by Gordon Mah Ung.
It is a bit dated but still applies to Corei7 and Intel D58XSO “Smackover” board.

http://www.maximumpc.com/article/features/exclusive_we_build_first_nehalem_system_dont_tell_intel

Both stories Published 29 Oct, 22nd Oct respectively:
Kingston Tech launches 2Ghz Triple-Channel 3GB Memory Pack for Core i7
Corsair Launches 1.86Ghz Triple-Channel 6GB Memory Pack for Core i7

Both are way out of my price range... I would preferably like 6GB for my Core i7 system, but with all other costs, that is starting to get into the clouds a bit...

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- Luke.

WOW that is a bunch of coin! I am sure prices will drop, when is the question.
All good info in this thread.

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